Книжкові видання та компакт-диски Журнали та продовжувані видання Автореферати дисертацій Реферативна база даних Наукова періодика України Тематичний навігатор Авторитетний файл імен осіб
|
Для швидкої роботи та реалізації всіх функціональних можливостей пошукової системи використовуйте браузер "Mozilla Firefox" |
|
|
Повнотекстовий пошук
Пошуковий запит: (<.>A=Yurchyshyn I$<.>) |
Загальна кількість знайдених документів : 6
Представлено документи з 1 до 6
|
1. |
Yurchyshyn I. Thermoelectricity of Nanostructures Based on Compounds of Lead Telluride [Електронний ресурс] / I. Yurchyshyn, D. Freik, L. Mezhylovaka, Ya. Yavorski // Proceedings of the International Conference Nanomaterials: Applications and Properties. - 2012. - Vol. 1, no. 2. - С. 02NFC14-02NFC14. - Режим доступу: http://nbuv.gov.ua/UJRN/princon_2012_1_2_16
| 2. |
Freik D. M. Size effects in p-PbTe nanostructures on polyamide [Електронний ресурс] / D. M. Freik, I. K. Yurchyshyn, V. Yu. Potyak, Yu. V. Lysiuk // Semiconductor physics, quantum electronics & optoelectronics. - 2011. - Vol. 14, № 3. - С. 344-349. - Режим доступу: http://nbuv.gov.ua/UJRN/MSMW_2011_14_3_17
| 3. |
Freik D. M. Quantum-size oscillation effects of thermoelectric parameters in lead chalcogenides nanostructures [Електронний ресурс] / D. M. Freik, I. K. Yurchyshyn, V. Yu. Potyak, V. M Chobaniuk // Ukrainian journal of physics. - 2014. - Vol. 59, № 2. - С. 167-171. - Режим доступу: http://nbuv.gov.ua/UJRN/Ukjourph_2014_59_2_10
| 4. |
Freik D. M. Quantum-Dimensional Effects in Thermoelectric Characteristics of Lead Chalcogenides Nanostructures [Електронний ресурс] / D. M. Freik, I. K. Yurchyshyn, V. Yu. Potyak // Journal of Vasyl Stefanyk Precarpathian National University. Series of social and human sciences. - 2014. - Vol. 1, no. 1. - С. 65-72. - Режим доступу: http://nbuv.gov.ua/UJRN/jovspnu_2014_1_1_9
| 5. |
Kuzey A. Mechanisms of structural-phase transformations during crystallization of a solder melt [Електронний ресурс] / A. Kuzey, V. Lebedev, A. Slipchuk, P. Tsykunov, I. Yurchyshyn // Ukrainian journal of mechanical engineering and materials science. - 2020. - Vol. 6, Num. 3-4. - С. 27-34. - Режим доступу: http://nbuv.gov.ua/UJRN/ujmems_2020_6_3-4_6 Problem statement. An important requirement is quality assurance of joining materials with minimal overheating of materials, lowering the soldering temperature and suppressing the interaction of the solder with the materials to be soldered. The heating of the solder and the holder should be as uniform as possible and with a minimum temperature difference along the depth. One solution may be to develop more efficient solders and fluxes, adapted to the high heating rates that are typical when using high frequency currents. Purpose. Thus, the problems of uniform heating of parts during brazing are relevant. This is necessary for optimal distribution of the electromagnetic field in the contact area Methodology. The effect of the heating rate was investigated. The composition of the flux and solders on the microstructure of the solders and the brazed seam was performed on the joints of HV510 (DIN), HS345 (DIN), HG30 (DIN) hardmetal plates with steel holders made of 5135 (USA) steel with a section of 25 x 20. Results. The research of the processes showed that during the contact interaction of low-melting and refractory components of the solders, when the tool was soldered, the solder is formed in the seam and proceeds through several stages. Practical value. Contact interaction of copper-zinc melts with iron particles does not lead to complete dissolution of iron particles. This is explained to the low values of the solubility of iron in copper-zinc melts despite the fact that resistive heat release occurs in the particles. Such iron particles (iron-based alloy) act as a dispersed phase in the structure of the composite material.
| 6. |
Yurchyshyn I. The Role of Metalinguistic Negation in Interpersonal Communication [Електронний ресурс] / I. Yurchyshyn // Studia philologica. - 2023. - Вип. 21. - С. 119-126. - Режим доступу: http://nbuv.gov.ua/UJRN/stfil_2023_21_11
|
|
|